1. Dual-mode efficiency enhancement: lossy/non-destructive processing dual stations, no interference, and save multiple equipment purchases, reducing investment;
2. Short technical route comparison and verification cycle: comparison of two processes, speeding up the experimental process, building exclusive technical barriers;
3. Ultra-fast picosecond cutting: narrow cutting path, small heat-affected area;

Silicon wafer cutting machine
The silicon wafer cutting machine is a lossy and lossless dicing machine. Its lossy scribing area uses ultraviolet lasers to laser scribing silicon wafers; the lossless cutting area uses infrared nanosecond fiber grooving, infrared continuous fiber laser heating, and cooling water cooling to slice silicon wafers into 1/2 and 1/4.

Highlights
1. One machine for multiple uses, partitioned and processed separately, small footprint, high cost performance;
2. Compatible with lossy and lossless cutting, lossy cutting size can be set arbitrarily, cutting accuracy is high, cutting path and heat-affected area are small;
3. Dust filtration efficiency ≥99.9%, in line with green environmental protection requirements.

Features
1. Semi-automatic operation mode
2. Equipped with machine vision positioning system for silicon wafer positioning and processing;
3. The non-destructive station is equipped with automatic material picking and rotation modules to provide cutting size accuracy;
4. The lossy cutting is equipped with ultrafast laser and galvanometer field mirror system, which can cut any size;
5. Ultrafast laser cutting speed is fast and the heat affected area is small;

Applications
1. Perovskite stacked cell cutting
2. Suitable for mass production customers such as megawatt line and G-watt line
3. For other battery materials, please consult our relevant personnel

Specifications
1. Product size: 210 mm×210 mm and various sizes below
2. The industrial camera is equipped with a high-magnification telecentric lens, and the CCD positioning accuracy is ≤±3μm
3. Processing objects: original silicon wafers, crystalline silicon cells, stacked cells
4. Scribing direction; lossy X or Y direction can be satisfied, lossless Y axis cutting
5. Lossy slicing
Line width: ≤50μm
Line width accuracy: ±10μm
Straightness: ±20μm
Cutting size accuracy: ±50μm
Heat-affected zone: ≤25μm
Equipped with a visual system to capture the pattern of the sample and adjust the cutting position
6. Non-destructive slicing
Line accuracy: ±100μm
Equipped with a water removal module to remove surface water after cutting
7. Base flatness: ≤±30um
10. Processable file formats: standard Gerber files, DXF files, DWG files, etc.
11. Windows 11 control PC, 21.5-inch monitor
12. TeamViewer remote access
13. Installation and training by Microtreat staff on site
14. Dust is collected by a dust collector, exhaust flow: >200m3/h, duct diameter: ￠100mm
15. Compressed air Pressure: 0.5～0.7Mpa, flow rate: <200L/min, compressed air pipe diameter: ￠10mm
16. Marble base and metal welded frame
17. Ground feet with seismic isolation function
18. Dimensions: 2300mm×1100mm×1900mm, 2300kg
19. Rated power 15KW
20. 3-color status signal tower
21. Interlock or Sensor installed at all door panel positions

Options
1. Local power
>208V/60Hz
>480V/60Hz
2. Multiple laser wavelengths for optimal material absorption
>355nm 15W output power
>1064nm 20W output power
3. Lasers with different pulse widths: nanosecond fiber lasers, picosecond, femtosecond and other ultrafast lasers
4. Contact us to learn about your specific needs